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Applications:
Used for HDI, multilayer circuit board, flexible circuit board surface cleaning, removing slag and etch back
Features:
1. Excellent process performance: ion density and energy, high etching amount, stable uniformity.
2. Highly integrated, small footprint, high productivity, low gas consumption, and low cost.
3. Humanized design: friendly interface in Chinese and English, easy to operate.
Tel：0755-23016190 
Contact:Miss Zhang 
URL：www.toyotechnology.com 
Address: 1F, Meisheng Yungu Tengyun Valley,Zhancheng Street, Bao'an District, Shenzhen
